TechBlick Innovation Festival, 22 June 2023. Silicon Carbide (SiC) -based solutions are attractive for high end applications in EVs and renewable energy supplies. Compared to traditional silicon components they offer a higher efficiency, higher switching frequencies, reduced switching losses, higher operation temperatures and a better robustness. Critical steps for the integration of power modules are…
DoMicro presented state-of-the-art technology at TechBlick conference on Additive Electronics in Semiconductor Packaging and PCBs. The presentation showed how inkjet printed interconnections can enable micro assembly of thin and compact devices. There is a market need for creating thinner devices with thinner interconnections, for instance in applications in in-mold electronics or smart glass. There is…
DoMicro participated as an exhibitor at the LOPEC 2023 in München, Germany. There was a lot of interest in the development of sustainable products. The demonstrator of a solar-powered business card was well received. It illustrates how DoMicro supports the transition to sustainability with application support and technology development. LOPEC is a key event for…