Video: More functionality in less space with printed wirebonds – TechBlick virtual conference (30 March 2023)
DoMicro presented state-of-the-art technology at TechBlick conference on Additive Electronics in Semiconductor Packaging and PCBs. The presentation showed how inkjet printed interconnections can enable micro assembly of thin and compact devices. There is a market need for creating thinner devices with thinner interconnections, for instance in applications in in-mold electronics or smart glass. There is…