by Rahul | May 29, 2023 | DoMicro news
DoMicro presented state-of-the-art technology at TechBlick conference on Additive Electronics in Semiconductor Packaging and PCBs. The presentation showed how inkjet printed interconnections can enable micro assembly of thin and compact devices. There is a market need...
by Rahul | May 5, 2023 | DoMicro news
DoMicro participated as an exhibitor at the LOPEC 2023 in München, Germany. There was a lot of interest in the development of sustainable products. The demonstrator of a solar-powered business card was well received. It illustrates how DoMicro supports the transition...
