DoMicro has developed an extremely slim and compact demonstrator for wireless IoT devices. High accurate inkjet printing technology and micro assembly techniques have been applied to create a flexible IoT device as thin as possible. By integration of ultra-thin bare dies, the total z-height of the demonstrator is less than 0.7 mm
Wireless Flexible Hybrid Electronics interface
Typically for having wireless functionality for IoT devices some sensing function, computing processing and radio functionality should be combined and integrated for operating remotely in between network nodes. DoMicro has built a very slim and compact demonstrator showing these functions by integration of a bare die micro controller and Bluetooth radio IC onto a polyester foil. Typical advantage over standard wire bond interconnection is the ability to print functional circuitry on all kinds of thin and bendable substrates. Next to that, the ability to integrate a bare die chip face up instead of flip chip, can expose the sensor interface in an extremely low z-height package solution. Actively powered with the external cell battery for demonstration, this device is showing 2 way Bluetooth communication with a cellphone app. Touch functionality is activated by a sensor area on the sample. The mode of the sensor button is shown on the app just like the LED that can be switched on/off remotely.
This demonstrator shows the functionality and technology for wireless bidirectional communication 2 integration in an extremely slim, compact and flexible form factor.
For more information read the article in OPE Journal #34
